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  creat by art - ultrafast, soft recovery characteristics - high junction temperature up to 175c - negligible leakage sustain the high operation temperature - planar passivated for voltage ruggedness and reliability - very low stored charge and its soft recovery minimize ringing and electronical noise to reduce power loss in associated mosfet or igbt - high capability for high di/dt operation. - high surge current capability - halogen-free according to iec 61249-2-21 definition - aec-q101 qualified ideal solution used as freewheeling diodes , features extremel y low peak recovery current helping to significantly reduce snubbing, and lower switching losses in igbt, especially as heavy duty applications demanding long term reliability. such as inverters , uninterrupted power supply, motor drive and other mission-critical systems where the high frequency and high efficiency is needed. the series with negligible leakage, is an immediatel y competitive advantage for high temperature environment. symbol unit v rrm v i f(av) a r jc c/w t j c t stg c document number: ds_d1501012 version: a15 - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec typical applications mechanical data case: to-220ac molding compound, ul flammability classification rating 94v-0 packing code with suffix "g" means green compound (halogen-free) polarity: as marked mounting torque: 0.56 nm weight: 1.7g (approximately) UGA15120 taiwan semiconductor 15a, 1200v ultrafast power rectifier features terminal: matte tin plated leads, solderable per jesd 22-b102 meet jesd 201 class 1a whisker test to-220ac maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter UGA15120 maximum repetitive peak reverse voltage 1200 maximum average forward rectified current 15 non-repetitive peak forward surge current 8.3ms single sine-wave i fsm 200 a maximum instantaneous forward voltage (note 1) if= 15 a v f 2.9 v 58 maximum reverse current @ rated vr i r typ max t j =25 c t j =125 c 15 - 55 to +175 a 5 100 reverse recovery time t rr typ max t j =25 , i f =0.5a, i r =1a, i rr =0.25a 48 storage temperature range - 55 to +175 note 1: pulse test with pw=300 s, 1% duty cycle typical thermal resistance ns t j =25 , i f =1a, di f /dt= -100a/ s, v r =30v -65 2 operating junction temperature range 1 2
(t a =25c unless otherwise noted) document number: ds_d1501012 version: a15 ratings and characteristics curves UGA15120 taiwan semiconductor order information (example) 0 5 10 15 20 0 25 50 75 100 125 150 175 average forward a current (a) case temperature ( o c) fig.1- forward current derating curve resistive or inductiveload with heatsink 0 50 100 150 200 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2- maximum non-repetitive forward surge current 8.3ms single half sine wave 0.01 0.1 1 10 100 0 20406080100 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 4- typical reverse characteristics t j =125 c t j =25 c 0.1 1 10 100 00.511.522.53 instantaneous forward current (a) forward voltage (v) fig. 3- typical instantaneous forward characteristics t j =125 c pulse width=300 s 1% duty cycle t j =25 c UGA15120 c0g green compound ? code packing ? code part ? no.
min max min max a - 10.50 - 0.413 b 2.62 3.44 0.103 0.135 c 2.80 4.20 0.110 0.165 d 0.68 0.94 0.027 0.037 e 3.54 4.00 0.139 0.157 f 14.60 16.00 0.575 0.630 g 0.00 1.60 0.000 0.063 h 13.19 14.79 0.519 0.582 i 4.95 5.20 0.195 0.205 j 4.42 4.76 0.174 0.187 k 1.14 1.40 0.045 0.055 l 5.84 6.86 0.230 0.270 m 2.20 2.80 0.087 0.110 n 0.35 0.64 0.014 0.025 p/n = marking code g = green compound yww = date code f = factory code document number: ds_d1501012 version: a15 marking diagram UGA15120 taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) to-220ac 10 100 1000 0.1 1 10 100 junction c apacitance (pf) a reverse voltage (v) fig. 5- typical junction capacitance f=1.0mhz vsig=50mvp-p
assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1501012 version: a15 UGA15120 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,


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